Introduction:
Golden Copper Heatsinks are perfect for cooling off small components such as chips and large power components, to increase surface. They come with thermal grease and can be stuck directly after tearing down the paper.
Size Dimensions (mm): 14 (L) X12 (W) X5.5 (H)
Weight: 35 g
Intended use: memory particles heat or other appropriate uses of heat.
Use steps:
1, check the chip size, to determine the size of not less than the product
2, remove oil chip surface
3, remove the membrane attached to the bottom of the product
4, the product is attached to the center of the wafer
5, pressing the heatsink 1-2 minutes, so a good heatsink and chip bonding
6, after moving or vibrating machines, please check the heat sink attached to the chip is complete
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